Qualcomm Technologies, a subsidiary of Qualcomm has announced multiple 5G platforms at Mobile World Congress targeted to smartphones, WiFi and robotics vertical.
Qualcomm announced the Qualcomm Snapdragon Mobile Platform with 5G integrated into a System-on-Chip (SoC). The company builds on its 5G leadership with the Snapdragon X50 and X55 5G modems and RF front-end (RFFE) solutions by offering a newly integrated Snapdragon 5G mobile platform, which reinforces the company’s role in providing the global mobile ecosystem with the flexibility and scalability needed for broad and fast 5G adoption.
OEMs will be able to utilize the investments made on the Snapdragon X50 and X55 modems to enable accelerated commercialization on the new integrated 5G platform. The new integrated Snapdragon 5G mobile platform is scheduled to sample to customers in the second quarter of 2019, with commercial devices expected in the first half of 2020.
Qualcomm has also introduced the new Qualcomm Automotive WiFi 6 chip, the QCA6696, bringing the next generation of WiFi and Bluetooth connectivity to the automotive industry. Complementing the Qualcomm Snapdragon Automotive 4G and 5G Platforms, the QCA6696 is Qualcomm Technologies’ most advanced WiFi solution designed to offer fast, secure and efficient WiFi connectivity, to meet consumer demands for greater robustness and reduced latency when operating in congested and dense environments.
Qualcomm has announced Robotics RB3 Platform – the company’s first integrated, comprehensive offering designed specifically for robotics. This purpose-built platform features ahighly optimized set of hardware, software and tools designed to help manufacturers and developers create the next generation of advanced consumer, enterprise and industrial robotics products.
Based on the Qualcomm SDA/SDM845 system-on-chip (SoC), the platform integrates key capabilities such as high-performance heterogeneous computing, 4G/LTE connectivity including CBRS support for private LTE networks, a Qualcomm AI Engine for on-device machine learning and computer vision, hi-fidelity sensor processing for perception, odometry for localization, mapping, and navigation, vault-like security and WiFi connectivity.
The Qualcomm Robotics RB3 Platform also plans to introduce 5G connectivity support later this year to further enable low-latency and high-throughput industrial robotics applications.