NXP Semiconductors has announced the immediate availability of its new RF Front-End Solutions for 5G infrastructure enablement.
NXP’s portfolio addresses several of the thorniest issues – power amplifier integration, shrinking board space, and true footprint and pin-compatibility between variants – involved in creating the cellular infrastructure for massive multiple-input, multiple output (mMIMO) and, by extension, 5G.
NXP’s new Front-End Solutions for 5G, unveiled at this week’s International Microwave Symposium (IMS2018), address the significant, critical challenge of creating cost-effective, high performance solutions in the smallest form factor to enable the next generation of active antenna systems (AAS) for cellular infrastructure.
NXP answers that challenge with a portfolio of highly integrated solutions that feature much smaller form-factors— making them easy and more cost-effective for customers to plug-and-play between all frequency bands and power levels.
“These devices have been developed to enable our customers to design their systems at the lowest cost possible,” says Mario Bokatius, product line director for NXP’s front-end solutions.
“Moving forward, you can look to NXP for even more integration as we continue our commitment to providing the industry’s smallest footprint and lowest cost solutions,” added Bokatius.
“Sophisticated RF beamforming and interference mitigation technologies are a need of the hour to achieve India’s goals of 5G. Our leadership and deep wireless communication industry knowledge positions us well to be an instrumental partner to continue to accomplish these goals and deliver 5G solutions for our customers in India and across the globe,” says Sanjay Gupta, Vice President & India Country Manager, NXP.
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